Technology

• Ultra-high Precision - nanometer range etch rate and encoder resolution
• High Flexibility - design changes can be implemented in a cost- and time-effective way
• Scalability - in principle there are no limits to the substrate size (proven up to Gen6: 2000 x 1500 mm)
• Simply the Best - in many cases there are no alternative technologies, particularly for special feature geometries on large areas

However, we don't restrict ourselves to using lasers. With our background in mechanical materials processing we are happy to consider alternative technologies or combinations of technologies to find the optimum solution to meet your micro-structuring challenge.

Achievable Characteristics

• Lateral dimension of features: < 1 µm – 1000 µm
• Feature height or depth: < 1 µm – 250 µm
• Wall angles and slopes: 0° - 90°
• Fast micro-lenses f# < 1
• Any lens geometry (e.g. a-spherical, fresnel, elliptical)
• Large variety of optical geometries (e.g. moth eye, corner cube, prism)
• High aspect ratio features (4:1)
• Optical surface finish (RMS < 20 nm)
• Tight geometrical feature tolerances (±0.3 µm)
• 100% fill factor (any packaging, e.g. hexagonal, square)
• Large area processing (proven up to 2000 mm x 1500 mm)
• Process time: ~12h for 3 m2 area with 10 µm deep structures